1. Excellent soldering point gloss.
  2. Long term printing stability
  3. Good Thixotrophy, free of soldering bead.
  4. Meeting 40 strict test, it can satisfy any kinds of manufacturing operation.
No. 15-01A 15-01B 23-01A 23-01B
Alloy Composition SN63/37PB SN63/37PB SN62/2AG/36PB SN62/2AG/36PB
Flux content 9.3% 9.3% 9.3% 9.3%
Melting point 183℃ 183℃ 179℃ 179℃
Halogen Content 0.02 0.02 0.02 0.02
Powder particle diameter 20-45μm 20-38μm 20-45μm 20-38μm
Viscosity Number 170±10Pas 170±10Pas 170±10Pas 170±10Pas
Application 0402 High precision electronic 02010.15mm Micro pitch 0402 high precision good conductibility Micro pitch 0201 QFP communication appratus