Lead Free Solder Bar - Ku Ping Enterprise Co., Ltd. solder, solder wire, No./Clean Solder wire, solder bar, solder flux, solder pen, solder machine, kuping, lead free solder wire, 台灣固品企業有限公司, 焊錫, 錫, 錫棒, 錫絲, 助焊劑, 錫爐, 烙鐵, 抗氧錫棒, 免洗錫絲, 錫膏, 無鉛銲錫, 免洗助焊劑, 無鉛錫

Lead Free Solder Bar

No.	Alloy Composition	Composition	Melting Point	Sp. Gravity	Packing	Remarks
B67	Sn-Cu	SN/CU0.7	228℃	7.3	1Kg / 5Kg	Extrusion type
B33	Sn-Ag	SN/AG3	218℃	7.4	1Kg / 5Kg	Extrusion type
B35	Sn-Ag	SN/AG3.5	221℃	7.4	1Kg / 5Kg	Extrusion type
B0305	Sn-Ag-Cu	SN/AG0.3/CU0.5	221℃	7.4	1Kg / 5Kg	Extrusion type
B0307	Sn-Ag-Cu	SN/AG0.3/CU0.7	221℃	7.4	1Kg / 5Kg
B3051	SN-Ag-Cu-Sb	SN/AG3/CU0.5/SB0.2	217℃	7.4	1Kg / 5Kg

US Patent No. 5405577
Japan Patent No. 2752258

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