1. Erection
  2. Viscosity rate
  3. Viscosity value (function)
  4. Full crystallization
  5. Printability
  6. Washability
  7. Evaporation time Printing durability
  8. Heating sputtering
  9. Dryness after soldering
  10. Crack of rosin
  11. Softness of rosin
  12. Heat collapse point
  13. Heat shifting
  14. Heat oil expel
  15. Residual base surface
  16. Rosin coverage
  17. Solder bead
  18. Diffusibility  
  19. Gloss
  20. Smog
  1. Halogen Content
  2. Corrosiveness
  3. Insulation
  4. Solder point brightness
  5. Toxicity
  6. Flux overflow
  7. Gas breathing point
  8. Oxidation
  9. Acid number
  10. moisture absorption
  11. Smell
  12. change after cold store
  13. Adhesiveness
  14. Oil buoyancy
  15. Shelf life
  16. Oxygen content
  17. Particle distribution
  18. shape
  19. Composition
  20. Flux content
  1. Excellent alloy composition at much lower melting point with better fluidity, better soldering saturation with less blank soldering or false soldering.
  2. Excellent thixotrophy resulted to almost bead less
  3. Providing excellent soldering effect for 0.2 mm pitch, QFP, 0201 printing
  4. Stable long time printing without withered phenomenon.
  5. Nitrogen Gas free operation
  6. Temperature resistance up to 280℃ with soldering point open for probe testing
No. KUP 16-03A(B) KUP 31-05A(B) KUP 32-06A(B) R-905
Alloy composition SN/3.5AG P3051 SN/AG/BI/IN SN/3AG/0.5CU
Flux content 11% 11% 11.50% 11%
Melting point 221℃ 217℃ 190℃ 218℃
Halogen Content 0.03 0.025 0.03 0.03
Particle diameter A20-45μm
B20-38μm
A20-45μm
B20-38μm
A20-45μm
B20-38μm
 20-45μm
Viscosity 175Pas 180Pas 170Pas 180Pas
Application
  • Good moisture effect
  • A: Suitable for 0.2mm/PiTch 0402
  • Bead free
  • B: suitable for 0.15mm/PiTch QFP 0201 micro pitch.
Remark US Patent No. 5405577,     Japan Patent No. 2752258 Distributed under license of Kester