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Lead Free Solder Cream
In order to lay concrete foundation for lead-free solder paste, Ku Ping secured advanced techniques from overseas manufacturer and try and test repeatedly before going into lead-free process formally. become a technically independent producer. Ku Ping is now equipped with the quality of world class supplier and is capable to develop new products to meet needs of our customers.
Our basic requirements on Solder Paste are as the following
- Erection
- Viscosity rate
- Viscosity value (function)
- Full crystallization
- Printability
- Washability
- Evaporation time Printing durability
- Heating sputtering
- Dryness after soldering
- Crack of rosin
- Softness of rosin
- Heat collapse point
- Heat shifting
- Heat oil expel
- Residual base surface
- Rosin coverage
- Solder bead
- Diffusibility
- Gloss
- Smog
- Halogen Content
- Corrosiveness
- Insulation
- Solder point brightness
- Toxicity
- Flux overflow
- Gas breathing point
- Oxidation
- Acid number
- moisture absorption
- Smell
- change after cold store
- Adhesiveness
- Oil buoyancy
- Shelf life
- Oxygen content
- Particle distribution
- shape
- Composition
- Flux content
Features
- Excellent alloy composition at much lower melting point with better fluidity, better soldering saturation with less blank soldering or false soldering.
- Excellent thixotrophy resulted to almost bead less
- Providing excellent soldering effect for 0.2 mm pitch, QFP, 0201 printing
- Stable long time printing without withered phenomenon.
- Nitrogen Gas free operation
- Temperature resistance up to 280℃ with soldering point open for probe testing
Specification
| No. | KUP 21-03A | KUP 31-05B |
|---|---|---|
| Alloy composition | SN/Bi | P3051 |
| Flux content | 9.2% | 11% |
| Melting point | 142℃ | 217℃ |
| Halogen Content | 0.05 | 0.04 |
| Particle diameter | A20-45μm |
A20-45μm B20-38μm |
| Viscosity | 175Pas | 175Pas |
| Application |
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| Remark | US Patent No. 5405577, Japan Patent No. 2752258 | |
Taipei Head Office
- No. 5, Ln. 302, Xinshu Rd., Xinzhuang Dist.,
New Taipei City, Taiwan (R.O.C.) - TEL : 886-2-82013987-9
- FAX : 886-2-82012388 / 82012368
- E-mail : kupingco@ms38.hinet.net
- E-mail : solder@kuping.com.tw
- URL : www.kuping.com.tw
- Taichung Liaison Office
- No. 70, Minyou Rd., Qingshui Dist.,
Taichung City , Taiwan (R.O.C.) - TEL : 886-4-2626-1089
- FAX : 886-4-2627-1756