1. Free of melting after long term use.
  2. The suitable substrate for solder is low impurity metallic material, the gloss and soldering ability has reached reliable level.
  3. Excellent stability and alloy quality.
  4. Conforming to AA Class Specification
No. Alloy composition Sb As Bl Cd In Ag Cu Al Fe Ni Zn
KP 63/37 SN63/PB .005 .005 .002 .0005 .003 .0005 .001 .0002 .003 .0005 .0003
KP 60/40 SN60/PB .005 .005 .002 .0005 .003 .0005 .001 .0002 .003 .0005 .0003