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Features

  1. Adheres to many materials, appropriate for all forms of soldering
  2. Non-corrosive, no unpleasant odor
  3. Transparent rosin residue for shiny solder spots
  4. Excellent wetting
  5. Soldering can be accoplished Faster, saving　time and labor

Specification

composition% Sn/Pb 63/37 Sn/Pb 60/40 Sn/Pb 50/50 Sn/Pb 45/55 Sn/Pb 40/60 Sn/Pb 30/70
melting point℃ 183℃ 183~190℃ 183~215℃ 183~227℃ 183~238℃ 183~258℃
specific gravity 8.4 8.5 8.87 9.06 9.28 9.7
diameter mm or inch 3.0(.114")     2.0(.079")     1.2(.047")   0.8(.032") 　　　　　　　　
2.5(.098")     1.6(.063")     1.0(.04")     0.5(.02")     0.3(.0114")
package 0.1KG     0.2KG     0.25KG     0.5KG     1KG     2GK     5KG     10GK

Classification

Item K-300
Content of flux (Wt%) 1.5~2.5
TYPE RA
Content of (Wt%) 0.3~0.4
Corrosion on Copper Plate passed
Aqueous solution resistant (Ω cm) 100,000 over
Insulation resistant (Ω) 1x1012 over
Direct Current Voltage (Ω) 1x1012 over
Expansion (%) 90
Features for use in general electronic devices and trolling soldering with high reliability
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